2026 Taiwan Semiconductor Career Day – Taiwan, CCU
Interested in pursuing a career in Taiwan's semiconductor industry? Join the 2026 Taiwan Semiconductor Career Day at National Chung Cheng University and connect directly with leading semiconductor companies through on-site one-on-one interview opportunities.
Participating Companies
• ASE
• SPIL
• Winbond
• Himax
• CHIPBOND
Event Information
Date: June 5, 2026 (Friday)
Time: 13:00–16:00
Venue: Banquet Hall, 3rd Floor, East Building, Administration Building, National Chung Cheng University
Eligibility
Applicants must hold a bachelor's degree or above in STEM-related fields and meet at least one of the following conditions:
• International students graduating in Taiwan
• International professionals
• Gold Card holders
• APRC holders
• Spouse residency holders of ROC citizens
• ARC holders with a valid work permit
• Overseas applicants requiring visa/work permit sponsorship
Required Document
• English or Mandarin CV
Application Process
- Submit your application by June 2, 2026.
- Shortlisted applicants will receive interview confirmation from the organizer.
- Attend the on-site one-on-one interviews on June 5, 2026.
Application Deadline
June 2, 2026
Registration
https://global.cake.me/hf1IPe
Disclaimer
This opportunity is shared for information purposes only. Applicants are advised to refer to the organizer's official announcement for detailed eligibility requirements and application procedures.